XPS Analysis:
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Surface chemistry and film stoichiometry, especially subject to variation for sputtered or CVD films
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Elemental composition as a function of depth, useful to examine multilayer film structures such as anti-reflective coatings, metallization layers on ceramics for brazing, or coatings such as TiN on biomedical devices
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Interface contamination
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Surface hydration measurements
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Failure analysis of delamination problems
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Determine whether film layers have reacted or boundaries are sharp
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Diffusion as a function of temperature in vacuum
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Reaction of discrete film with other layers or with substrate as a function of temperature, such as due to brazing or soldering
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Reaction of film or multilayered film with heating in various gases
FTIR Analysis:
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Detect and identify thin organic or polymer film on metal or semiconductor surface
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Identify thin organic film used to prevent reactions of a thin film structure with the environment as in corrosion
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Identify plastic or polymer with metallization film
Thin Film Thickness Measurements:
Surface Roughness:
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Substrate surface structure analysis or profilometry
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Nucleating growth of film
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Film as deposited
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Oxidized or reacted film
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Columnar growth surface porosity
Reactivity of Thin Film:
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TGA measurement of film weight gain due to reaction with gas as temperature is increased
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TGA testing of oxidation protection offered to substrate material by thin film or test for reactivity at higher temperatures and examine by XPS afterward
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DSC measurement of exothermal heat of reaction due to reaction of film with substrate or with other layers in multilayer structures, such as for intermetallic phase formation
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DSC measurement of endothermal heat of melting or of crystalline phase changes
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DSC measurement of exothermal heat of reaction with heating in a gas
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XPS substrate element diffusion through film to surface in active atmosphere conditions or upon heating
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Multilayer film interlayer reactions by depth profile XPS
Electrochemical and Corrosion Testing:
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Corrosion rate measurement for metal films
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Pitting potential measurement for metal films
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Pin-hole detection for all films
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EIS to determine changes of thin film capacitance or resistance which measure water and ion ingression
Cross Section Analysis:
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Thickness measurement
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Grain size and orientation
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Detection of inclusions
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Uniformity
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Observable phases (carbides, intermetallic phases, graphite micro clusters, etc.)
Adhesion Failures:
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Failure analysis of peeled or delaminated thin film for locus of failure and detection of contamination, hydration, reacted layer, or other causes of failure using XPS and FTIR
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Examination with metallographic microscopy or SEM to determine mode and locus of failure
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