XPS or ESCA Surface Analysis:
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Surface contamination detection and identification
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Surface oxide chemistry
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Identification of corrosion products
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Surface segregation of elements in alloys; carbon, sulfur, and phosphorus being examples in addition to metal elements
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Depth profile elemental analysis to measure graphitic carbon and carbide concentrations as a function of depth
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Determine the chemistry of anodized surfaces
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Determine cause of adhesive bond failures on metal surfaces
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Examine the surface chemistry of metal particles prior to sintering for powdered metallurgy
Electrochemical Analysis and Corrosion Testing:
FTIR or Infrared Spectroscopy Analysis:
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Identify organic coatings on metal surfaces
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Identify organic contaminants on metal surfaces
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Identify carbonate, sulfate, nitrate, nitrite, phosphate, and hydroxide layers on metal surfaces
DSC Analysis:
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Determine alloy melting temperature and the heat of fusion if the melting point is below 725°C
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Measure the heat capacity
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Determine temperature and exothermal energy of intermetallic phase formation
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Determine temperature of crystalline structural (shape-memory included) or magnetic phase transformations (curie temperatures)
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Determine temperature and energy of a precipitation reaction such as those in many aluminum alloys
TGA Analysis:
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Measure rate of gas reaction with metal as a function of temperature
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Determine the Curie temperature of magnetization of ferromagnetic materials
TMA Analysis:
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Measure the rate of thermal expansion as a function of temperature
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Measure the melting point if it is below 800°C
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Measure the rate of surface layer growth due to reaction with gas as a function of temperature
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Determine the temperature of a structural phase change
SEM Analysis:
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Image surface morphology
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Determine fracture mode
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Determine crystalline domain sizes
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Measure phase distributions and identify phase types
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Examine oxide structure and growth modes
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Image wear effects
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Examine growth modes of deposited films
Cross Section Analysis:
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Determine cracking modes
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Determine inclusion content
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Examine for voids
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Examine structures for design integrity
Metallographic Analysis or Metallography:
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Examine grain sizes and shapes
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Examine phase distribution and identify type
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Examine coating defects such as holes, pores, and cracks
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Measure density and type of inclusions
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Measure density and size of voids
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Measure the thickness of oxide or surface treatment layers
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Examine solder and braze joint cross sections for defects
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Examine the heat-affect zone near welds and brazed joints
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Determine cracking modes in metals (transgranular, intergranular, etc.)
[Example: Cross Section Analysis]
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Examine grain by grain variations of oxide thickness on highly oxidized metal surfaces
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Examine the onset of corrosive reaction or pits
Profilometry or White Light Interference Microscopy:
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Measure surface roughness
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