XPS or ESCA Analysis:
-
Depth profile MBE-deposited multi-layer structures on GaAs
-
Determine stoichiometry of sputter-deposited or MOCVD materials
-
Determine cause of soldering, bond pad, and adhesive bond difficulties
-
Identify photoresist or wax residues, contaminants, and surface segregated impurities
-
Measure thickness and determine uniformity of oxides, nitrides, or other film layers
-
Depth profile multifilm contact structures on silicon or GaAs wafers
-
Determine composition of thermal compounds or adhesives
-
Evaluate the cleanliness of ceramic or plastic packaging materials
-
Evaluate PCB laminate interfaces and surface conformal coatings
-
Measure contamination on alumina feedthroughs and solve brazing problems
-
Determine composition of electroplated gold and other metals, particularly on surfaces to which impurities migrate
-
Chemistry of polyimide coating surface and effects on outgassing
-
Identity cause of metallization layer delamination
-
Detect and identify contaminants on connectors on plastic, ceramic, or pins
-
Determine causes of corrosion
Infrared Spectroscopy or FTIR analysis:
-
Identify flux residue
-
Identify wax residue
-
Identify thermal compound
-
Identify adhesive
-
Identify conformal coating
-
Identify resin in circuit board
-
Identify component plastics
-
Identify polyimide coating
-
Identify photo resist
TMA or Dilatometry:
-
Measure thermal expansion properties of materials or IC packages
-
Determine softening temperature of plastics & polymers or their degree of crystallinity
-
Measure extent and temperature of plastic crystalline transitions
-
Measure polymer or plastic glass transition temperature
DSC:
-
Measure the specific heat of a material
-
Measure energy of intermetallic phase formation
-
Measure degree of cure of epoxy materials for electronic packaging or of epoxy adhesives
-
Measure melting point temperature of solders, fluxes, waxes, sealants, and potting compounds
TGA or Thermogravimetry:
-
Measure weight loss by outgassing
-
Measure degree of water absorption
-
Measure total fiberglass content in printed circuit boards
DMA:
-
Measure glass transition temperature of printed circuit boards
Electrochemistry:
-
Evaluate corrosion resistance of coated Kovar hermetic packages
-
Strip coated metal layers to measure their thickness
-
Measure corrosion rates and pitting potentials of contacts and pins
-
Examine corrosion of electronics enclosures
Metallographic / Optical Microscopy / SEM:
-
Cross-section analysis of solder joints, connectors, or ceramic capacitors
-
Determine polysilicon grain sizes
-
Check for voids in PCB material or in solder joints
-
Determine whether copper foil layers have the proper surface characteristics in a PCB material
-
Examine boards or wafers for anomalies
Profilometry:
-
Step-height measurements of deposited layers / metallization films
-
Surface roughness of metallic films
|
