Electronics

Anderson Materials Evaluation, Inc. has performed many investigations into materials, processing, device, printed circuit board, connector, and packaging issues of the electronics industry.  We have identified the cause of anomalous appearance and contamination on semiconductor wafers.  AME has applied surface analysis and depth profile analysis to identify problems in the composition of insulating, barrier, bonding transition, and protective films on processed wafers.  We identified the causes of bonding problems on device bonding pads.

We found flaws in ceramic capacitors and in transistors.  We identified the cause of contamination on contact surfaces, on surface-mount solder arrays, on ceramic hermetic packages, and on printed circuit boards.  We have checked through-hole solder joins for voids and contamination.  AME has identified mask cleaning problems.  We performed failure analysis on delaminating metallization films on wafer, ceramic, and polymer surfaces.  We performed analyses of circuit board, connector, and metal hermetic package corrosion problems.  We have examined the purity of electroplated gold metallization and cases of out-migration of the electroplate bath contaminants.  Characterizations of wafer polishing materials before and after polishing have been provided.  Waste products have also been identified from both treatment and downstream water sewer systems.

We have measured the coefficient of thermal expansion (CTE) of devices, integrated circuit packages, and ceramic and metal hermetically sealed packages.  AME has determined the glass transition temperature of the plastic encapsulation of IC packages.

AME analysis projects of electronics have been performed for clients in the semiconductor, integrated circuit, satellite electronics, civil and defense aviation, intelligence agencies, biomedical device, optical communications, electric and gas power, manufacturing automation, consumer products, mobile phone, and the warfare department activities.  Among our clients are or have been:

  • Advanced Technology Materials, Inc.
  • Antec, Inc.
  • Apple, Inc.
  • Artic Silver, Inc.
  • BAE Systems
  • Baltimore Gas & Electric
  • Brighton Technologies Group, Inc.
  • Brewer Science, Inc.
  • Caliper, a PerkinElmer Company
  • Carlisle Interconnect Technologies
  • Compac, Inc.
  • Conexant Systems
  • Corvis, Inc.
  • Cooper Bussmann, Inc.
  • CTS Corporation
  • Curtiss-Wright Electro-Mechanical Corp.
  • DRS Technologies, Inc.
  • Eaton Semiconductor Equipment Div.
  • Ebara Technologies, Inc.
  • Electronic Systems Inc.
  • Emerson Climate Technologies
  • Energy Div. of Electro-Mechanical Corporation
  • Epitaxial Technologies LLC
  • Fibertek, Inc.
  • First Solar Manufacturing
  • Fusite Div. of Emerson Electric Co.
  • Gigavac, LLC
  • GMT Microelectronics
  • Harris Corporation
  • Hoya Corporation USA
  • Inphi Corporation
  • Joslyn Electronic Systems
  • Kapteyn-Murnane Laboratories Inc.
  • LAM International Corporation
  • Lam Research Corporation
  • Laird Technologies
  • Level 3 (former Corvis)
  • Lincoln Electric Company
  • Littelfuse, Inc.
  • Lockheed Martin Electronic Systems
  • M.E.C. Tech
  • Methode Electronics, Inc.

 

  • Miasole
  • Nanoconduction Inc., acquired by Unidym, Inc.
  • Northrop Grumman Electronic Systems
  • Nufern Inc.
  • Oryx Advanced Materials, Inc.
  • Paratek Microwave
  • Paricon Technologies Corp.
  • PATx, Inc.
  • Petra’s Tech Shop
  • Polycom
  • PRI Automation Inc.
  • Raytheon Corp.
  • Qualcomm MEMS Technologies
  • RF Monolithics, Inc.
  • Research in Motion, Paratek Microwave
  • Rothfuss Engineering Co.
  • Schneider Electric
  • Sensorex
  • SDM & Associates, Inc.
  • SEAKR Engineering, Inc.
  • Sercel, Inc.
  • Silicon Turnkey Solutions Inc.
  • Silicone  Technology Corp.
  • Skyworks Solutions, Inc.
  • Space Systems/Loral
  • Spire Corporation
  • SRI International
  • Strube, Inc.
  • Sylarus Technologies LLC
  • Synovis Caribe, Inc.
  • Temp Flex Cable Inc.
  • Thermo Fisher Scientific Inc.
  • Trace Laboratories, Inc.
  • Tronics Group
  • Trumpf Photonics Inc.
  • Unitrode Corp.
  • Varian Semiconductor Equipment
  • Vestas – American Wind Technologies, Inc.
  • Voltage Multipliers, Inc.
  • Wilson Greatbatch Technologies Inc.
  • WJ Communications Inc.