Voids in the solder on the connector side of a soldered joint in a printed circuit board. Voids are shown by arrows. Note the poor wetting of the lead on the right side, suggesting that contamination on the lead generated the gas that caused the voids.

Fiber Reinforced Plastic (FRP) cross section with several layers of fibers is shown. One layer has a large void shown by arrow.

A fractured edge (shown by arrow) of a green ceramic capacitor as a result of its mishandling during soldering assembly.