With focusing X-ray monochromator, differentially pumped and rastered ion gun depth profiling, specimen heating, 200 amu quadrupole Residual Gas Analysis in ultrahigh vacuum.
Provides quantitative elemental and chemical analysis of 6-8 nm depth & ion depth profiling to 2 μm in analysis areas of 150-600 μm dia. Correlation of surface properties with temperature and outgassed species. Unique chemical analysis of complex phases. Analyzes all elements, except H, in all materials with sufficiently low vapor pressure.
Scanning Auger Microprobe (SAM):
With elemental mapping, depth profiling, SIMS, and radial sectioner.
Provides semi-quantitative elemental analysis and some chemical analysis to 5 nm depth, with ion sputtering to 2 μm or radial sectioner to 2 mm in analysis area of 0.1 μm on conductor materials and somewhat larger areas for semiconductors.
Provides molecular functional group and bonding identification to depths of 1-2 μm, especially useful for polymer, organic, and glass materials, but also some inorganic materials.
Quadrupole Mass Spectrometer Residual Gas Analysis:
In XPS/ESCA with heating, on TGA/DSC outflow gas, and with fracture, heating and puncture capability in a defined headspace.
Provides gas and vaporizable species identifications 1-200 amu.
Provides 10 nm lateral resolution images with excellent depth of field, measures size of small features with image analysis, accompanied by specimen cross sectioning and polishing of even very hard materials.
TGA provides weight loss due to decomposition, outgassing, and combustion; or weight gain due to absorption or reaction with environment gas; yielding composition and hydration.
DSC provides measurement of exothermic and endothermic reaction energies, phase change, and glass transition temperatures.
TMA measures thermal expansion, glass transition temperatures, crystalline to amorphous phase transitions, softening temperatures, and melting temperatures.
DMA measures moduli and energy loss parameters, glass transition temperature, and rheology as a function of frequency and temperature.
Operation in a glove box allows the handling of materials susceptible to water or air absorption or oxidation. Measurements can be made under a variety of gaseous atmospheres.
Evaluates materials compatibility, environmental corrosivity, and potential methods for protection against corrosion.
Potentiostatic, galvanostatic, and potentiodynamic polarization techniques allow the characterization of corrosion phenomena such as corrosion rate, localized attack (pitting, crevice corrosion), and galvanic attack.
EIS allows evaluation of coating performance and under-coat corrosive attack, measuring coating resistance and capacitance.
Using XPS or SAM on extremely thin films and coatings, interference microscopy for step-height profilometry, eddy current or magnetic probe metering, SEM imaging, and sectioning on thicker coatings.
CO2 snow jet, Plasma (Microwave, Oxygen, or Hydrogen), UV, and Solvent Cleaning and Effectiveness Analysis
Trial cleaning procedures are performed on a material or device on a small scale and evaluated with surface analysis to determine the suitability for the customer’s application.
X-ray Diffraction (XRD)
Provides crystal structure information, particularly the identification of structural phases, thin film reflectometry multi-layer thin film analysis, strain, grain size, preferred orientation, and texture.
